The paper addresses the issue of embedding the rectangular printed circuit board (PCB) – the placeholder for a complex sensor system circuit – in the glass fibre laminate during the lamination. The change of the material mechanical properties due to the presence of foreign objects in the laminate is assessed by experimental testing through standardized methods ASTM D3039, ASTM D6641 and ASTM D3518. Local stress–strain relationship near the PCB in the out-of-plane direction of the specimen are monitored through the use of GOM ARAMIS 2M digital image correlation method scanner. Based on the scanned model, a finite element simulation is generated and validated.
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