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  Estonian Journal of Engineering

ISSN 1736-7522 (electronic)  ISSN 1736-6038  (print)

 An international scientific journal
Formerly: Proceedings of the Estonian Academy of Sciences Engineering
(ISSN 1406-0175)
Published since 1995

Estonian Journal of Engineering

ISSN 1736-7522 (electronic)  ISSN 1736-6038  (print)

 An international scientific journal
Formerly: Proceedings of the Estonian Academy of Sciences Engineering
(ISSN 1406-0175)
Published since 1995

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Seebeck’s effect in micromachined thermopiles for infrared detection. A review; 338–353

(Full article in PDF format)


Authors

Alexander Graf, Michael Arndt, Gerald Gerlach

Abstract

Beginning with the discovery of Seebeck, thermopiles have come increasingly under the spotlight of commercial infrared sensing. The constantly growing interest has motivated us to write an overview of micromachined thermopiles. The first part deals with the Seebeck effect and discusses the most important physical parameters. In the second part, the most important material systems, techniques and micromachined structures are discussed on the basis of different examples. We explain the motivation behind miniaturized thermopile detectors and give a functional explanation of physical interrelations. Finally, different applications are presented and discussed in terms of their future potential.

Keywords

thermocouple, thermopile, semiconductor, temperature measurement.

References

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Current Issue: Vol. 19, Issue 4, 2013





Publishing schedule:
No. 1: 20 March
No. 2: 20 June
No. 3: 20 September
No. 4: 20 December